Description: Z20 Reballing Middle Layer Platform For iPhone X XS MAX 11 12 PRO PCB Planting Tin Holder Disassembly Board BGA Solder


Function: Reballing fixture


MJ 10 in 1 BGA Reballing Stencil Platform Jig Fixture is professional BGA Reballing Stencil Fixture for iPhone X-12/12pro, For iPhone X-12/12pro motherboard BGA reballing fixture tool, is used for positioning and reballing For iPhone X- 12/12pro PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone X-12/12 pro BGA reballing and repairing.


Steps:

1. Take out the Z20 tin planter and place the bottom plate

2. Place gaskets as needed (when planting tin in the RF middle frame of the XSMax motherboard, you need to place functional functional gaskets and then place the RF dedicated tin planting net)
3. Place the main board and locate it through the positioning column and limit area
4. Place the tin-planting net magnet according to the model to automatically adsorb the positioning hole and align the tin-planting station positioning post
5. Place tin spacers according to requirements
6. Use a tin scraper to evenly fill the mesh with tin paste

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Z20 Reballing Middle Layer Platform

  • Product Code: طقم أدوات الشبلنة للوحة الأم للجوال ايفون
  • Availability: Pre-Order
  • ر.س212.75 ر.س

  • Ex Tax: ر.س185.00 ر.س

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